发布时间：2022/10/13 浏览量：3818

君睿科技提供 P5000 CVD 设备的操作维护培训和移机调机以及零配件供应

第一部分 p5000 CVD设备和 操作介绍 

The  PRECISION 5000 CVD was designed to sloved the many problems associated with chemical vapor deposition of low temperature in both MOS AND bipolar devices.  AMAT P5000 CVD provides a revolutionary solution to the problem of low temperture dielectris. The flexible multi-chamber system is capable of handling all of your dielectric needs in a single system that addresses the challenges. It's advantage as below :

1. Enabling technology

2. Ultimate flexiblity

3.Superior intermetal dielectrics

4. Versatility to meet all CVD requirements

5. Passivation

6. Conformal Oxide Depositions

7. Doped Oxides

8.Process integration for the future

9. Modularity leads to flexibility

10.Full factory automation

一、Purpose 目的 :

To define the operating procedures for the P5000 CVD processes.

确认操作P5000 CVD 操作规范。

二、Scope 内容：

2.1 Outline the process qualification requirements for the CVD process chambers. 

确定CVD 操作腔体的处理质量要求。

2.2 Define all CVD process recipe parameters. 

定义CVD 参数 

2.3 Describe documentation for Process control and Lot Records.

处理控制和记录操作文件描述

三、Associated Materials and Equipment 相应材料和设备明细 ：

3.1 AMAT Heat exchanger - Heated Galden, 4gal volume.  AMAT 换热器

3.2 Exhaust - MFC enclosure.     MFC 排气外壳 

3.3 Vacuum pump oil – Fomblin  真空泵油

3.4 H2-Hydrogen. 氢气

3.5 N2-Nitrogen.   氮气

3.6 PH3:H2-Phosphine.   PH3:H2磷化氢。

3.7 NF3-Nitrogen Trifluoride.  NF3三氟化氮。

3.8 He-Helium. 氦气

3.9 N2std-Nitrous Oxide. N2std一氧化二氮。

3.10 SiH4-Silane. SiH4硅烷。

3.11 Deionized water.去离子水

3.12 Isopropyl alcohol. 异丙醇

3.13 150mm silicon wafers. 150mm硅片

3.14 Nilfisk vacuum cleaner.Nilfisk真空吸尘器

3.15 Clean room wipes. 洁净室湿巾。

3.16 Wafer cassette – Fluoroware PA182-39M or equivalent. 晶片盒

四、Safety 操作安全

4.1 The P5000 system uses reactive gases that require careful handling. These gases are toxic, poisonous, flammable or caustic and provide inhalation or exposure risks, see MSDS. 

4.2 The P5000 system uses high voltage electrical power and presents lethal risks if protective covers are removed. 

4.3 The P5000 system uses RF energy, presenting electrical and radiation hazards if safety interlocks are defeated or covers are removed. 

4.4 The P5000 system produces hazardous byproducts in the process chambers, always wear clean room gloves when cleaning the chamber, and dispose of used wipes and gloves in the solvent waste can. 

4.5 The P5000 has moving mechanical parts, keep fingers clear when robot, cassette elevator, load lock elevator, slit valves, or susceptor might be in motion.

 4.6 The P5000 system uses high magnetic fields which may disrupt pacemakers

4.1 P5000系统使用需要小心处理的反应性气体。这些气体有毒、易燃或具有腐蚀性，有吸入或接触危险，见MSDS。

4.2 P5000系统使用高压电源，如果拆除保护罩，则存在致命风险。

4.3 P5000系统使用射频能量，如果安全联锁失效或盖子被拆除，则会产生电气和辐射危险。

4.4 P5000系统在工艺室中产生有害副产品，清洁室时始终戴上洁净室手套，并将用过的湿巾和手套处理在溶剂废物罐中。

4.5 P5000具有可移动的机械部件，当机器人、盒式升降机、负载锁定升降机、开缝阀或接收器可能在运动时，请保持手指畅通。

4.6 P5000系统使用高磁场，可能会干扰起搏器.

五、Procedures 程序 

5.1 The system will automatically logoff the current user after 8 hours. Go to the Login/Logout page located under the “System” header menu and Logout the last user, then Login using “AMAT” as the user name and “5458” as the password.

5.2 As the system processes wafers, warnings or indicators may show on the screen. There will also be an alarm. The following colors give indications to the systems status. 

5.3 Red – is a fault, it will stop all processes and maintenance must be notified. Touch red line at to of screen to silence and clear the alarm 

5.4 Yellow – is a warning. Often times the system will self correct this and will continue running. Either way, notify maintenance. Touch the yellow line at top of screen to silence and clear the warning.

 5.5 Blue or Green – are always good. These are normal operating indicators and no notification is necessary. These indicators may be silenced by touching the blue or green line at the top of the screen. 

5.6 Wafers may be loaded in either cassette A or B position on the handler. A is on the left and B is on the right. When loaded, insure the H-Bar on the cassette is aligned with the H-Bar on the cassette handler. If the cassette desired on the cassette handler is unavailable press “shuttle cassettes. 

5.7 Press the “Load” button on the operator control panel on the front of the P5000. The front panel will open and the cassette clamp will release.

 5.8 If the clamp does not release press “Clamp” at the bottom right, of the System Control Screen, press “Cassette” clamped and “Release” to unlock. 

5.9 Load wafer(s) into cassette, place on flat finder, and rotate wafer(s) to flats UP position. 

5.10 Verify that wafers are ready for the operation listed on the flowsheet by verifying prior step has been signed off. 

5.11 From the “Wafer” header menu, select the “Monitor Wafer” screen. Load cassette into P5000 and clamp the cassette, deleting any unused wafer slots. 

5.12 To delete press the first slot of unused wafers. A pop-up screen appears press “Start delete sequence”. Press wand on the last wafer to delete. Press “Finish delete sequence”

5.13 From the “Control” header menu, select the correct recipe in the “Sequence selection”, and set
system state to “Automatic”.
5.14 Verify that the tools actual software recipe parameters match the documentation, and the values
indicated on the Lot Flow sheet.
5.15 Select “Run (Go) Button” from the “Wafer” header to start processing.
5.16 Check that all requested wafer(s) are transferred to the loadlock (8 maximum).
5.17 Monitor and record the following information during the processing of the first wafer.
5.18 Verify that all wafers have changed from white (unprocessed) to green (completed process) when
the “All processing of wafers is complete” appears above the header menu.
5.19 Once the wafers have completed the process run press the UNLOAD button on the front of the
operator control panel on the front of the P5000. The front panel will open and the cassette clamp
will release. The cassette can now be removed.
5.20 Date and initial the flowsheet, and send to the next operation.

5.1系统将在8小时后自动注销当前用户。转到“系统”标题菜单下的登录/注销页面，注销最后一个用户，然后使用“AMAT”作为用户名，“5458”作为密码登录。

5.2当系统处理晶片时，屏幕上可能会显示警告或指示灯。也会有警报。以下颜色表示系统状态。
5.3红色-故障，将停止所有流程，必须通知维护。触摸屏幕至处的红线可静音并清除警报
5.4黄色-警告。通常情况下，系统会自动纠正此错误并继续运行。无论哪种方式，都要通知维护部门。触摸屏幕顶部的黄线可静音并清除警告。
5.5蓝色或绿色-总是好的。这些是正常的操作指示灯，无需通知。触摸屏幕顶部的蓝线或绿线可使这些指示灯静音。

5.6晶片可装入处理器上的盒式磁带A或B位置。A在左边，B在右边。装载时，确保磁带盒上的H-Bar与磁带拾取器上的H-Bar对齐。如果磁带处理器上所需的磁带不可用，请按“梭式磁带”。

 5.7按下P5000前面操作员控制面板上的“加载”按钮。前面板将打开，盒式磁带夹将释放。

5.8如果夹钳没有松开，请按系统控制屏幕右下角的“夹钳”，然后按“卡式磁带”夹钳和“松开”解锁。

5.9将晶片装入暗盒，放在平板探测器上，并将晶片旋转至平板向上位置。

5.10通过验证之前的步骤是否已确认，验证晶片是否已准备好进行流程图上列出的操作。

5.11从“晶圆”标题菜单中，选择“监控晶圆”屏幕。将盒式磁带装入P5000并夹紧盒式磁带，删除所有未使用的晶片插槽。

5.12要删除，请按未使用晶片的第一个槽。出现一个弹出屏幕，按“开始删除序列”。按最后一块晶圆上的棒进行删除。按“完成删除序列”

5.13从“Control”（控制）标题菜单中，在“Sequence selection”（顺序选择）中选择正确的配方，并设置系统状态设置为“自动”。

5.14验证工具实际软件配方参数是否与文件和值匹配如批次流程图所示。

5.15从“晶圆”标题选择“运行（执行）按钮”开始处理。

5.16检查所有请求的晶圆是否已转移至装载锁（最多8个）。

5.17在第一片晶片的加工过程中，监控并记录以下信息。

5.18在以下情况下，验证所有晶片已从白色（未加工）变为绿色（已完成加工）标题菜单上方显示“所有晶圆加工完成”。

5.19晶片完成工艺运行后，按下晶片正面的卸载按钮P5000前面的操作员控制面板。前面板将打开，磁带夹将发布。现在可以拆卸磁带。

5.20对流程图进行日期和初始设置，并发送至下一个操作。

六 、Daily inspection 每日检查 :

6.0 Daily leak-up 

6.1 Daily Leak up rates must be performed before running any material.

6.2 Press “Vacuum Service” with the pen. The screen will display Chambers A, B, C, and Loadlock. Ensure that all three chambers are “Offline for Maintenance”.

6.3 Press the “Offline for Maintenance”. 

6.4 Press “Leak-up”. 

6.5 Press “Enter Leak-up parameters”. 

6.6 Press “Start leak up program”. The system will begin leak-up. Perform leak-up on all three process chambers and the loadlock. Record readings in the MES system. Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000-607B”. Use the second pull down menu to choose “P5000 Daily Leak Rates”. 

6.7 Vent the Load lock by pressing “loadlock” and “Chamber vent 

6.8 Repeat the leak up for chambers A,B,C. 

6.9 Pump down the loadlock and repeat the leak up. Record readings in the MES system. Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000-607B”. Use the second pull down menu to choose “P5000 Daily Leak Rates”.

6.10 The Leak Up rate specification for the process chambers is <10mt/min and the loadlock is <20mt/min. If the Leak Up rates do not meet the specification, contact maintenance. Material may be run if all chambers and the loadlock pass Leak Up.

7.0 Daily SPC/Gas Flow Checks and Heat Exchanger 日常换热器检查 :

7.1 Check all gas flow pressure daily. 

7.2 Gauges are located on the floor in the maintenance area. There are three locations with Plexiglas viewing windows. 

7.3 Read the pressure gauges on each of the gas flow lines. Compare with “P5000 Gas Flow” document. If readings are not within the specified range notify engineering. Do not run the machine. 

7.4 Verify the Heat Exchanger is set to 40 degrees. Press “System Facilities”. Press “Heat exchanger” at the bottom of the screen. A pop-up window will appear at the top and the heat exchanger should read 40 degrees.

七、每星期检查

 8.0 Weekly SPC/particles 每星期颗粒检查:

 8.1 Obtain 3 virgin prime silicon wafers.

 8.2 Measure three wafers on the Tencor Surfscan 6100 (Refer to Tencor Surfscan 6100 specification). 

 8.3 Load wafers in slots 1-3. 

 8.4 Run wafers in slot 1 and 2 through “Cycle A” serial sequence program. Slot 3 is used for a witness wafer. 

 8.5 When wafers have completed processing measure the 3 wafers on the Tencor Surfscan 6100. Record readings in the MES system. Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000A-607B”. Use the second pull down menu to choose “P5000A CH A Particles”. 

 8.6 Repeat these steps for Chamber B using “Cycle B” and Chamber C using “Cycle C” serial sequence programs. 

 8.7 If particulate count exceeds 100 place wafers in monitor box and obtain and measure a virgin silicon wafer. 

 8.8 Repeat test. 8.9 If the chamber fails particles a second time, notify engineering/maintenance.

9.0 Weekly SPC/MFC Flow Verify ： 每星期MFC 流量计确认 

9.1 Press “OFFLINE for Maintenance” under Chamber A. 

9.2 Press “MFC FLOW VER”. 

9.3 Verify that all gases are set at 50%. 

9.4 Press “Start Flow Verify”. The chamber will start flowing gases. 

9.5 When the system has completed the flow, record readings in the MES system. Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000A-607B”. Use the second pull down menu to choose “P5000 SPC Machine Parameters”. 

9.6 Repeat for Chambers B and C. 

9.7 MFC Flow Verify can be run on all chambers simultaneously. 

10.0 Weekly SPC/ Process monitors 每星期流程监测 

10.1 Obtain two wafers from the virgin prime silicon wafer box for Chamber C SiN SPC. 

10.2 Measure wafers on the Tencor FLX-2350FP stress tool. (Refer to Tencor FLX-2350FP specification located in the Metals folder on the Q drive). Double click on the “Winflex” icon. Select “barry”, Click “OK”. Pull down the “Measure” icon. Choose “First (no film)”. Use “sinchc.dat”. Identify wafers by date and slot number, i.e. “10-02-s1”. 

10.3 Load wafers on the P5000. Press “1K SIN B” on the system control screen. 

10.4 When wafers have been processed clear the alarm. Measure wafers on the Tencor FLX-2350FP stress tool. Pull down the “Measure” icon. Choose “Single”. Use “sin-chc-dat”. Pull down the correct wafer id. Enter the stress reading into the MES system. 

10.5 Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000C-607B”. Use the second pull down menu to choose “SiN Stress”. 

10.6 Measure the wafers on the Woollam ellipsometer located in the Photo area. Choose Project “Kay”, choose Recipe “SiN on Si 9pt Rudolph pattern”. Identify wafers by date, chamber and slot number, i.e. “071003-c1”. Use the Woollam Process Procedure to retrieve data with your thumb drive when both wafers have completed the measurement routine. (Refer to Woollam ellipsometer specification). 

10.7 An excel Macro has been created that will download the Woollam data and record this data in the MES system. Load the thumb drive into the MES computer across from the P5000. Open “ Copy of Upload Chamber SPC” located on the desk top. Another window will appear, press “Enabl

Macros”. A pop-up screen will appear, log-in, and press “Open file for Parameter Upload”. Highlight the Woollam files for upload, the program will prompt for the deposit time to be inserted in the pop-up screen for each file. The data is then transferred to the MES system. 

10.8 When all the data for the chamber has been entered review the files, if trends are noticed notify engineering. 

10.9 Obtain two wafers from the virgin prime silicon wafer box for Chamber C a-Si SPC. 

10.10 Measure wafers on the Tencor FLX-2350FP stress tool. (Refer to Tencor FLX-2350FP specification located in the Metals folder on the Q drive). ). Double click on the “Winflex” icon. Select “barry”, Click “OK”. Pull down the “Measure” icon. Choose “First (no film)”. Use “a-sichc.dat”. Identify wafers by date and slot number, i.e. “10-02-s1”.

10.11 Load wafers on the P5000. Press “1K SIN B” on the wafer process screen. 

10.12 When wafers have been processed clear the alarm. Measure wafers on the Tencor FLX-2350FP stress tool. Pull down the “Measure” icon. Choose “Single”. Use “a-si-chc-dat” file. Pull down the correct wafer id. Measure both wafers. 

10.13 Pull down “Edit”, choose “Data Files”, click on “a-si-chc.dat”, press “Okay”. Highlight the SiN readings, Click on “Edit”, choose “Create No film rec”. Delete all other readings except for these two points. 

10.14 Load the same wafers on the P5000. Press “Amorphous-Si” on the wafer process screen. 

10.15 When wafers have been processed clear the alarm. Measure wafers on the Tencor FLX-2350FP stress tool. Pull down the “Measure” icon. Choose “Single”. Use “a-si-chc.dat”, Pull down the correct wafer id. Enter the stress reading into the MES system. 

10.16 Press “Non Lot Data Collection” located on the first menu page. Use the pull down menu to choose “AMATP5000C-607B”. Use the second pull down menu to choose “a-Si Stress”. 10.17 Measure the wafers on the Woollam ellipsometer located in the Photo area. Choose Project “Kay”, choose Recipe “aSi on 1KA SiN 9pt Rudolph pattern”. Identify wafers by date, chamber and slot number, i.e. “071003-ca1”. Use the Woollam Process Procedure to retrieve data with your thumb drive when both wafers have completed the measurement routine. Refer to section 

10.7 in this specification for instructions on transferring data to the MES system. (Refer to Woollam ellipsometer specification). 

10.18 Obtain two wafers from the virgin prime silicon wafer box for Chamber B nc n+ SPC. 

10.19 Measure wafers on the Tencor FLX-2350FP stress tool. (Refer to Tencor FLX-2350FP specification located in the Metals folder on the Q drive). ). Double click on the “Winflex” icon. 

                                                                 第二部分 ：AMAT P5000 设备常见问题和维修介绍

介绍完P5000 CVD 设备日常操作、安全和每日、每星期点检流程，如您还有其它P5000 设备维护需求，请参考 ：

https://www.junr.com.cn/semiconductor%20news/683.html AMAT P5000 设备的保养维修和调机一文 

如果您的p5000设备的保养维修需求是以上原因或者其它方面的问题需要我们协助，欢迎联系我们！我们专业的p5000 资深设备维修工程师拥有十多年一线设备维修维护保养的处理经验，君睿科技有多年CVD p5000 设备维修改造服务的业绩和经验，您有任何关于CVD p5000 设备维护 腔体更换、部件精密清洗、各种冷泵、干泵的维修和泵零部件更换等需求，欢迎与我们联系！

                                                                第三部分 ：p5000 CVD 设备 重点零配件供应介绍 

以下列出我司重点OEM 的 P5000 零配件： 

PART NUMBER	DESCRIPTION	标题	品牌 BRAND
0020-30797	shower head	PLATE PERF 200 GIANT NITRIDE	Applied Materials
0020-90213	blocker	BLOCKER PLATE SILANCE 200MM	Applied Materials
0020-10117	shower head	PLATE PERF 200MM TEOS	Applied Materials
0020-32036	blocker	BLOCKER PLATE  200MM	Applied Materials
0020-30086	shower head	PLATE PERF 150MM NITRIDE	Applied Materials
0020-30580	blocker	BLOCK PLATE 150MM NITRIDE	Applied Materials
0020-10771	shower head	PLATE PERF 150MM OXIDE	Applied Materials
0020-30447	blocker	BLOCKER PLATE SIN	Applied Materials
0020-10119	shower head	plate perfect 100-150mm	Applied Materials
0020-09316	blocker	blocker plate 150mm	Applied Materials
0020-10122	shower head	plate perf 125mm oxide	Applied Materials

其它详细p5000 零配件需求，可到我司官网搜索查询。

各种P5000 线路板 链接 https://www.junr.com.cn/v/list/id/87.html

各种 p5000 阀门产品链接 https://www.junr.com.cn/v/list/id/88.html

其它各种p5000 零部件 ，包含石英件 、金属件腔体部件、汞灯、robort arm、light pen 等，参考链接 https://www.junr.com.cn/v/list/id/89.html